POSTER SESSION 1 1. Analysis of long

POSTERSESSION1
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Analysisoflong-timeefficiencyofthephotovoltaicinstallation
DąbrowskiJacek;KracEwa;GóreckiKrzysztof
InvestigationsofmutualthermalcouplingbetweenSiCSchottkydiodessituatedin
thecommoncase
GóreckiKrzysztof;BisewskiDamian;ZarębskiJanusz;KisielRyszard;MyśliwiecMarcin
ModellingdynamiccharacteristicsoftheIGBTwiththermalphenomenatakeninto
account
GóreckiKrzysztof;GóreckiPaweł
AFMmeasurementsofzincoxidepiezoelectricproperties
RacOlga;SikoraAndrzej;FiedotMarta;Suchorska-WoźniakPatrycja;TeteryczHelena
Compositefibresdopedwithcarbonnanoparticlesforuseintextronics
RacOlga;FiedotMarta;KarbownikIwona;RybickiTomasz;KarpińskaAngelika
NitrogendopedZnOandnanostructuredZnO-basedhomojunction
GuziewiczElżbieta;PietrzykMieczysławA.;PrzeździeckaEwa;SnigurenkoDmytro;
KopalkoKrzysztof;PaszkowiczWojciech
Copper-basedalloysforinterconnectionsinpowerdevices
GuziewiczMarek;KruszkaRenata;PagowskaKarolina;MysliwiecMarcin;BarJan;
LaszczAdam;CzerwinskiAndrzej
ElectricalandmicrostructuralcharacterizationofdopedZnObasedmultilayer
varistors
KulawikJan;SzwagierczakDorota;SkwarekAgata
Investigationofvariousjointtypesforthermoelectricgeneratorsassembly
SkwarekAgata;WitekKrzysztof;ZachariaszPiotr
Thermalconductivityofsilicondopedbyphosphorus:abinitiostudy
AndriyevskyyBohdan;JankeWłodzimierz;StadnykVasyl';RomanyukMykola
InfluenceoffiringprofileonmicrostructuralanddielectricpropertiesofLTCC
substrates
PietrikovaAlena;RovenskyTibor;DurisinJuraj;VehecIgor;KovacOndrej
Structureandthermalstabilityofled-freesolderspreparedbymeltrapid
solidificationprocess
DurisinMartin;PietrikovaAlena;DurisinJuraj;SakslKarel;LivovskyLubomir;Girasek
Tomas
POSTERSESSION1
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InvestigationofNano-InksBehaviouronFlexibleandRigidSubstratesunderVarious
Conditions
LukacsPeter;PietrikovaAlena;BallokovaBeata;JakubeczyovaDagmar;KovacOndrej
TrapsspectroscopyofInAs/GaSbsuperlatticebarriermid-wavelengthinfrared
detectors
CiuraŁukasz;KolekAndrzej;WróbelJarosław;MartyniukPiotr
Stencilprintingforcontactdepositiononthecrystallinesiliconsolarcells
PanekPiotr;SypieńAnna;Musztyfaga-StaszukMałgorzata;JakubowskaMałgorzata
ThermalInterfaceMaterialsbasedonGrapheneandsilvernanopowderfor
photovoltaics
SobikPiotr;PawłowskiRadosław;DrabczykKazimierz
Thedependenceofreliabilityandmechanicalstrengthofsolderjointsin3DPoP
structuresfromsizesofsolderpowdersappliedinsolderingmaterials
SitekJanusz;KościelskiMarek;BoreckiJanusz;SerzyskoTomasz
ComparativeanalysisofthethermalimpedanceofSiCdiodesplacedontheepoxy
andaluminumcorePCBs
KraśniewskiJarosław;ŚwitaRobert;SuszyńskiZbigniew
ThinfilmcapacitorwithBaTiO3dielectriclayerinkjetprintedonflexiblesubstrate
SzostakKrzysztofMarcin;WangPo-Chiang;FałatTomasz;FelbaJan
InfluenceofthescreenprintedelectrodesgeometryontheCopperdeposition
process
Drabczyk,Kazimierz;Bigos,Agnieszka
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Theminiaturethermopilefortemperaturegradientmeasurementontheborderof
integratedcircuit/heatsink
MarkowskiPiotr